# Tanner Tools Technology Setup
# File: Update.txt
# Vendor: AMI
# Technology: 0.5um C5X (SCN3ME_SUBM)
# Technology Setup and Test/Demo Suite: in file mamis05.tdb
#*********************************************************************

13 Aug 2002 - Tanner Version 1.03
- Added density DRC rules.

07 Aug 2002 - Tanner Version 1.02
- Add DevGen Setup to the Technology File.  This is a 
   preliminary release and it has not gone through 
   complete QA yet.

08 Oct 2001
- Updated Technology name to SCN3ME_SUBM, was SCN3M_SUBM.
- Updated all large metal rules to ignore all condition in DRC setup.
- Updated SPR setup (31Oct2001)

30 July 2001
- Update with current Mosis rules for AMI C5N SCN3ME

29 Dec 2000
- Poly2 width for cap is updated to 7 lambda.

11 July 2000
- Change name from PadFC to PadlessCorner.
- SPR Pad Route Setup: Layers tab, changed Pad via layer to Via1

31 Jan 2000
- Added rule 27.6b
- Removed NW/Poly resistor

17 Jan 2000
-mAMIs05.tdb, mAMIs05DL.tdb: updated poly2 wire to include: not "High Res Implant"
                      
05 Oct 1999
-mAMIs05.tdb: 	DRC rules 8.5 (a,b,c,d) are disabled
		DRC rules 9.2 (b,c) are disabled
-mAMIs05.ext:	Add statement for poly resistor over Nwell
 
03 Sept 1999 - Initial Released
- MOSIS AMI 0.5um Design Kit
  Technology = SCN3M_SUBM lambda = 0.30um

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Telephone: (626) 792-3000
Fax:       (626) 792-0300
e-mail:    support@tanner.com